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Electrochimica Acta· 2026Q1

Capturing transient selective copper dissolution from 316L stainless steel by reflectometry and element-resolved measurements

Jinyi Yuan, K. Ogle, Junsoo Han, Viacheslav Shkirskiy

Short summary

Reflectometry and atomic emission spectroelectrochemistry (AESEC) captured transient selective copper dissolution from 316L stainless steel, revealing a 0.4 nm CuO-equivalent layer dissolved upon potential release.

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Key points

  • In situ reflective microscopy (RM) and atomic emission spectroelectrochemistry (AESEC) were coupled to study transient surface states on 316L stainless steel.
  • An abrupt surface brightening was observed upon releasing the potential from vertex to open-circuit.
  • AESEC detected selective copper dissolution corresponding to a 0.4 nm CuO-equivalent layer after potential release.
  • A multilayer Fresnel model successfully reproduced the observed brightening, supporting the removal of a transient Cu-containing surface component.

AI-generated from the title and abstract; the full text is not read.

Abstract

Transient surface states can control the reactivity of stainless steel yet remain invisible to conventional post-mortem characterization because they may disappear as soon as electrochemical control is interrupted. Here, in situ reflective microscopy (RM) was combined with electrochemistry and matched atomic emission spectroelectrochemistry (AESEC) measurements to follow surface film evolution on 316L stainless steel. The surface progressively darkened during anodic polarization, but release from the vertex potential to open-circuit potential produced an abrupt brightening. Under the matched electrochemical sequence, AESEC detected selective Cu dissolution after potential release corresponding to a 0.4 nm CuO-equivalent layer. A multilayer Fresnel model containing a retained mixed-oxide passive film, in which CuO leaves the interface, reproduces the magnitude of the brightening under the selected optical assumptions. Residual-charge calculations admit conditional mixed-valence scenarios. Together with thermodynamic calculations, these results support selective removal of a transient Cu-containing surface component. Such short-lived states can escape detection during transfer and post-mortem analysis, which motivates coupled real-time monitoring.

The authors' abstract, as published at the source. Electrochimica Acta, 2026 · DOI ↗

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Field: Metals and Alloys

Metals and AlloysMaterials Science