Angewandte Chemie International Edition· 2026Q1

Reprocessable, Creep‐Resistant and Fully Biobased Thermosets for Power Semiconductor Packaging

Huarui Yao, Chang Jing, Aiqing Dong, Yanyun Li et al.

0citations
Q1SCImago
2026year

Short summary

A novel biobased thermoset (DHBEP/PF/AE) with 100% biomass content achieves reprocessability and high-temperature reliability (Tg 181°C, creep resistance up to 170°C) by enabling adaptive reorganization via side-group transesterification at nanodomain boundaries.

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Polymers and PlasticsMaterials Science