Calphad· 2026Q2
Thermal conductivity calculation of the Cu-Ni-Mn system by CALPHAD method
- 0citations
- Q2SCImago
- 2026year
Short summary
A CALPHAD-based model accurately predicts the thermal conductivity of Cu-Ni-Mn alloys, validated against experimental data.
AI-generated from the title and abstract; the full text is not read.
Key points
- A CALPHAD-type model was developed for thermal conductivity calculation in the Cu-Ni-Mn system.
- Model parameters were obtained for pure elements, binary, and ternary Cu-Ni-Mn systems.
- The model demonstrated good consistency with experimental thermal conductivity data.
- The validated model can predict thermal conductivity during industrial production.
AI-generated from the title and abstract; the full text is not read.
Abstract
The alloys in the Cu-Ni-Mn system exhibit exceptional properties of high strength and high thermal conductivity. Among them, the prominent solid-solution strengthening effect of Cu-based and Ni-based alloys makes them highly promising candidates for applications in aerospace, marine engineering, medical devices, electronic equipment, and auto parts. In this work, the thermal conductivity of the Cu-Ni-Mn system was evaluated by the CALPHAD (CALculation of PHAse Diagrams) method, and the corresponding parameters for the pure element, binary and ternary systems were obtained. The model using these parameters exhibit good consistency with the experimental data, which indicates that the CALPHAD-type model for thermal conductivity is valid and suitable for predicting the thermal conductivity of the Cu-Ni-Mn system. This work is helpful for predicting the thermal conductivity of Cu-Ni-Mn system during the industrial production process and improving production efficiency.
The authors' abstract, as published at the source. Calphad, 2026 · DOI ↗
Continue with a free account
Ask the paper: 3 free questions a day about this paper; save it, get its citation, new summaries every day for your field. Takeaways are Premium.
Continue free on the webSign in with Google or Apple; no card needed. You come back to this paper.
On your phone:
General Materials ScienceMaterials Science