ACS Nano· 2026Q1
Oxide-Nitride Heteroepitaxy for Low-Loss Dielectrics in Superconducting Quantum Circuits
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- 2026year
Short summary
Epitaxial γ-Al2O3 integrated into TiN/γ-Al2O3/TiN trilayers exhibits a low intrinsic dielectric loss of δTLS0 = (2.8 ± 0.1) × 10–5, establishing a new materials platform for superconducting quantum circuits.
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Key points
- Developed a heteroepitaxial TiN/γ-Al2O3/TiN trilayer structure for superconducting quantum circuits.
- Confirmed single-crystal quality and chemical integrity of all layers using advanced imaging and spectroscopy.
- Measured a low intrinsic two-level system dielectric loss for epitaxial γ-Al2O3: δTLS0 = (2.8 ± 0.1) × 10–5.
- Established heteroepitaxial oxides on transition metal nitrides as a viable materials platform for quantum technologies.
AI-generated from the title and abstract; the full text is not read.
Abstract
Abstract Superconducting qubits show great promise for the realization of fault-tolerant quantum computing, but lossy, amorphous dielectrics limit current technology. Identifying highly crystalline and stoichiometric dielectrics with intrinsically low microwave loss is therefore a central materials challenge, yet experimentally validated platforms remain scarce. This work integrates a crystalline dielectric into a heteroepitaxial TiN/γ-Al2O3/TiN trilayer grown via pulsed laser deposition. Correlative high-resolution imaging, diffraction, and spectroscopy measurements confirm the single-crystal quality and chemical integrity of all layers, with minimal defects and limited anion interdiffusion across the oxide–nitride interfaces. Using microwave lumped-element resonators with parallel-plate capacitors, this work establishes an experimentally measured upper bound for the dielectric loss of epitaxial γ-Al2O3, which has a low intrinsic two-level system loss of δTLS0 = (2.8 ± 0.1) × 10–5. These results establish heteroepitaxial oxides on transition metal nitrides as an attractive materials platform for superconducting quantum circuits, particularly for integration into compact device architectures such as merged-element transmons and microwave kinetic inductance detectors.
The authors' abstract, as published at the source. ACS Nano, 2026 · DOI ↗
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