Nature· 2022Q1
A large-scale microelectromechanical-systems-based silicon photonics LiDAR
- 423citations
- Q1SCImago
- 2022year
Short summary
A 16,384-pixel LiDAR with a 70° × 70° field of view and 0.6° resolution has been developed on a 10×11mm silicon photonic chip using MEMS-actuated optical switches, enabling random-access beam addressing at sub-MHz speeds.
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Key points
- Developed a 16,384-pixel LiDAR on a 10×11mm silicon photonic chip.
- Features a 70° × 70° field of view and 0.6° × 0.6° addressing resolution.
- Employs MEMS-actuated optical switches for random-access beam addressing at sub-MHz speeds.
- Achieves 1.7 cm distance resolution using FMCW ranging in a monostatic configuration.
- Monolithically integrated focal plane switch array (FPSA) is CMOS-compatible for mass production.
AI-generated from the title and abstract; the full text is not read.
Abstract
Abstract Three-dimensional (3D) imaging sensors allow machines to perceive, map and interact with the surrounding world 1 . The size of light detection and ranging (LiDAR) devices is often limited by mechanical scanners. Focal plane array-based 3D sensors are promising candidates for solid-state LiDARs because they allow electronic scanning without mechanical moving parts. However, their resolutions have been limited to 512 pixels or smaller 2 . In this paper, we report on a 16,384-pixel LiDAR with a wide field of view (FoV, 70° × 70°), a fine addressing resolution (0.6° × 0.6°), a narrow beam divergence (0.050° × 0.049°) and a random-access beam addressing with sub-MHz operation speed. The 128 × 128-element focal plane switch array (FPSA) of grating antennas and microelectromechanical systems (MEMS)-actuated optical switches are monolithically integrated on a 10 × 11-mm 2 silicon photonic chip, where a 128 × 96 subarray is wire bonded and tested in experiments. 3D imaging with a distance resolution of 1.7 cm is achieved with frequency-modulated continuous-wave (FMCW) ranging in monostatic configuration. The FPSA can be mass-produced in complementary metal–oxide–semiconductor (CMOS) foundries, which will allow ubiquitous 3D sensors for use in autonomous cars, drones, robots and smartphones.
The authors' abstract, as published at the source. Nature, 2022 · DOI ↗
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Field: Instrumentation
InstrumentationPhysics and Astronomy